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Japan's Minister of Economy, Trade and Industry Koichi Hagiuda pointed out at a press conference in Washington today that the United States and Japan have decided to establish a new joint international semiconductor research center.

On the evening of the 27th, a sudden power drop in Nanfang Science Park ("Nanke"), one of the three major science parks in Taiwan, caused some production line equipment of Nanke manufacturers to be affected. The Nanke Park gathers semiconductor manufacturing/foundry/packaging and testing companies including TSMC and UMC.

Recently, TSMC announced on the social media Linkedin the progress of the company's 5nm semiconductor fab "FAB21" in Phoenix, Arizona.

On July 26, a strong earthquake occurred near the Dolores region in the northern Philippines. The Philippines is one of the main production bases of passive components (especially MLCC) in the world. The earthquake may have a certain impact on MLCC and the packaging and testing industry.

On July 27, according to DIGITIMES, industry sources revealed that the supply of automotive and industrial chips is still tight, while the inventory of consumer chips continues to accumulate throughout the supply chain.

On July 26, South Korea's SK Group plans to invest $22 billion in the US manufacturing business for semiconductor, new energy and bioscience projects.

According to industry sources, Intel and MediaTek announced yesterday (25) a strategic partnership, with the additional condition that Intel needs to introduce its own Wi-Fi 6 chip technology to enhance MediaTek's business in this field.

The U.S. had previously issued an “ultimatum” to the South Korean government to reply to the invitation of the “Chip 4” by the end of August. South Korean officials revealed that the country would not accept the so-called time limit set by the U.S. side.

Recently, AMD has seen a huge increase in its sales, which has caused the company to rethink the budget of its research and development department, which spends millions of dollars in research and development every quarter. AMD's R&D department will further assist the company in developing core technologies and products.

On the morning of July 25th, Samsung Electronics held a 3nm chip shipment ceremony at the Hwaseong plant in Gyeonggi-do, South Korea. Kye Hyun Kyung, Minister of Industry, Trade and Resources of South Korea, head of Samsung Electronics DS department, executives and employees, suppliers and fabless fabs About 100 people including executives attended the event.