On July 13, automotive electronics giant Bosch announced that it will invest another 3 billion euros in the expansion of its semiconductor business by 2026.

According to reports, this budget will have 170 million euros for the company to set up development centers in Reutlingen and Dresden, and another 250 million euros for the renovation and upgrading of wafer manufacturing facilities to increase the clean room area About 3600 square meters.

In addition to capacity expansion, Bosch will further increase the development of new products and new processes. In addition to the mass-produced silicon carbide devices, Bosch is researching high-voltage gallium nitride power devices for vehicles to provide customers with more cost-effective products. options.

In addition, Bosch also revealed plans to expand its product layout in the field of system-on-chip (SoC) and MEMS, such as micro-sensors that provide integrated radar radio frequency for autonomous driving functions, and MEMS micro-projection modules that can be used in AR glasses.

Bosch also revealed that the company has applied for EU public funding and will participate in the development of microelectronics and communication technology in the Major Project of European Common Interest (IPCEI).

Currently, Bosch has 8-inch and 12-inch wafer fabrication facilities in Reutlingen and Dresden, respectively, and is building a semiconductor test center in Penang, Malaysia, which is expected to be operational by 2023.