Intel recently spent $3 billion to expand its DIX Mod3 advanced technology fab in Hillsboro, Oregon, with the goal of regaining its leadership in semiconductor process technology.

At the plant's opening ceremony, Intel CEO Pat Gelsinger reiterated the company's commitment to U.S. leadership in semiconductor research and development. Intel has renamed the nearly 500-acre (EETT editor: approximately 2.023 km2) campus in the Ronler Acres industrial area as "Gordon Moore Park" to remind the world that Moore's Law is still in effect - in recent years Since then, the industry has been worried that Moore's Law has lost its momentum.

"Intel has been committed to continuing to advance Moore's Law since its inception," Gelsinger said in a press statement. "This new facility will strengthen our ability to provide an accelerated process technology roadmap to support our bold IDM 2.0 strategy. Regon has long been a core powerhouse for our global semiconductor R&D."

The stronghold is the headquarters of Intel's global technology development division, responsible for advancing Moore's Law by creating new transistor architectures, wafer processes and packaging technologies that underpin the company's product technology roadmap. The Oregon facility is expected to provide basic technology for applications ranging from PCs, cloud infrastructure to 5G networks; the team has about 10,000 employees, mainly based in Hillsboro.

A key challenge for the team is scaling the functions on the chip down to the size of atoms. The Oregon fab is recognized for innovations such as high-k metal gate technology, tri-gate 3D transistors, and strained silicon, while All of this is fundamental to keeping up with Moore's Law.

“Those pioneering process innovations originated in the Oregon stronghold, which is well-positioned to deliver the next generation of leading-edge technologies with the latest expansion of our D1X facility,” said Ann Kelleher, general manager of Intel Technology Development. Semiconductors are the foundation of U.S. technological leadership, economics, and supply chain resilience, and Intel is the only company in the world with the majority of process and packaging R&D in the U.S., as well as high-volume production of cutting-edge semiconductor components."

Intel announced an ambitious process technology roadmap for 2021, aiming to regain leadership over its rivals TSMC and Samsung. Intel expects to accelerate the pace of innovation and the annual pace of progress to apply innovative technologies to new products after 2025.

Those innovations include Intel's gate-wrap RibbonFET, a new 3D transistor architecture; PowerVia, a backside power transfer technology, and extreme-ultraviolet (EUV) lithography with high numerical aperture (NA).

With this $3 billion investment to expand the D1X site, Intel engineers will have an additional 270,000 square feet (EETT editor: approximately 25,077.685 square meters) of clean room space for the development of next-generation silicon process technologies. Intel will also transfer technology from Hillboro to the company's global manufacturing locations.

Intel's factory in Oregon, USA, is the largest in the company in terms of scale and talent, with nearly 22,000 employees across four campuses in Hillboro; this expansion will increase the company's headquarters in Oregon. Invested more than $52 billion.

The company's goals also include securing a portion of the US government's $52 billion budget to revive local semiconductor manufacturing. The United States was once the world's largest chip maker, but currently accounts for only about 12 percent of global semiconductor manufacturing. The decline of the U.S. semiconductor industry is often cited as a national security weakness.

Intel said that with its employees, a vast network of local contractors and suppliers, capital investments and other downstream influences, the company contributes more than 105,000 jobs annually, more than $10 billion in labor income, and $19 billion in annual contributions. Gross Domestic Product (GPD) in USD.