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TSMC 2nm Fab Bidding to Complete by Year-End

2025-07-14 11:35:30Mr.Ming
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TSMC 2nm Fab Bidding to Complete by Year-End

According to reports, TSMC is set to hold its upcoming earnings call on July 17, where the market's attention will focus on the impacts of US tariffs and the progress of its Arizona fabs. According to Taiwan's Industrial & Commercial Times, despite ongoing tariff pressures, TSMC is actively scaling its production capacity to better serve global clients, particularly through accelerated construction of its first three semiconductor fabs in Arizona.

The latest supply chain updates reveal that TSMC's Arizona Phase 1 fab (P1), dedicated to 4nm production, commenced operations in Q4 2024. Construction of the Phase 2 fab (P2), designed for 3nm process nodes, began in April 2025, with mass production scheduled for the second half of 2027. The Phase 3 fab (P3), initially targeted for completion by the end of 2030 to support 2nm and beyond, has now entered an accelerated timeline, with contract bidding expected to complete by the end of 2025.

Industry insiders highlight that the interval between P2 and P3 construction is significantly shortened, underscoring a faster expansion pace driven by TSMC's growing expertise in semiconductor facility development. The company aims to reduce fab construction times in the US to around one year, progressively aligning with the rapid pace seen in Taiwan.

TSMC's expansion in Arizona is also creating substantial opportunities for its core Taiwanese partners. Companies such as CTCI, Foxsemicon, and United Integrated Services, which were involved in P1, are well-positioned to benefit further from subsequent phases due to their operational experience and established qualifications in the state.

Unlike other semiconductor players that adopt turnkey EPC models, TSMC leverages its deep project management expertise to subdivide and directly oversee critical infrastructure segments — including cleanroom construction, mechanical and electrical systems, chemical supply lines, ultrapure water, and gas treatment. This segmented approach streamlines procurement, reduces communication overhead, and enhances execution efficiency.

Meanwhile, Taiwanese vendors are actively aligning with TSMC's global strategy. CTCI has secured multiple operational licenses in Arizona, covering piping, HVAC, and refrigeration services. Foxsemicon holds certifications for boiler, steam piping, and electrical works in the state. Despite these advancements, challenges remain, particularly with local labor productivity and safety culture, which extend fab construction timelines to roughly one year, compared to Taiwan's standard three quarters.

Back home, TSMC continues aggressive capacity expansion in Hsinchu and Kaohsiung for advanced process technologies. However, industry players express concerns over power supply constraints, especially in northern Taiwan, where the grid is nearing capacity limits. Such constraints could delay data center construction and impact semiconductor firms' AI infrastructure deployment schedules.

Industry analysts note that TSMC's overseas expansion is driven not only by client requirements and US government incentives but also by Taiwan's structural limitations. For TSMC, the ultimate priority remains maximizing shareholder value rather than serving as a policy bargaining chip. As the industry evolves, passive or opportunistic operations are increasingly untenable in the face of global competition and strategic demands.

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