Samsung Group plans to invest $356 billion in the next five years, aiming to become a leader in semiconductors, biopharmaceuticals and other fields. Industry experts believe that it is still difficult for Samsung to shake the leading position of TSMC (2330) in foundry.

Liu Peizhen, researcher and director of the Industrial and Economics Database of the Taiwan Academy of Economic Sciences, said that the visit of US President Biden to Samsung has brought considerable confidence to South Korean semiconductors. In the future, the two parties may cooperate. Samsung also plans to invest heavily in the semiconductor and biomedical industries in the next five years. .

Liu Peizhen pointed out that in the semiconductor sector, Samsung needs to consolidate the memory layout, because China's Yangtze River Storage has made progress in storage-type flash memory (NANDFlash).

In the foundry part that the market is concerned about, Liu Peizhen said that Samsung is currently the closest in process technology to TSMC, and Samsung is also the world's second largest foundry. In the future, if customers want to choose the second foundry source, Samsung is a more likely target.

However, there is still a huge gap between Samsung and TSMC in the global foundry market share. Liu Peizhen said that TSMC's market share is 52.9%, much higher than Samsung's 18.3%. In terms of process advancement, Samsung's 3-nanometer process is still facing problems, while TSMC has mastered 3-nanometer orders.

Liu Peizhen said that Samsung's investment this time is the largest in history, and it may indeed drive Samsung to improve, but basically it is necessary to return to the semiconductor content such as technology and customer competition.

Liu Peizhen said that in terms of manufacturing technology, Samsung is not as good as TSMC; in terms of process yield, TSMC's ultra-high yield completely suppresses Samsung; in terms of competition with customers, Samsung cannot get rid of the problem of competing with customers.

Liu Peizhen said that in the face of rivals such as Samsung and Intel (Intel), TSMC continued to move forward, not only mass production of 3nm in the second half of the year, but also R&D to 2nm and 1.4nm. It is expected that TSMC wafers The leading position of OEM is stable.